Keynote Speakers

Keynote Speakers

Title: Innovation without boundaries

Speaker: David H. Robertson

Company: Analog Devices

David H. Robertson

May 27

Innovation without boundaries

The rapid expansion of technologies and capabilities across the domains of materials, circuits, algorithms, and software, is driving semiconductor industry growth across a range of applications in markets as diverse as automotive, industrial, communications, and healthcare. These advances are supporting new opportunities in smart manufacturing, autonomous vehicles, personalized healthcare, and others.
Product solutions that address these emerging opportunities require comprehensive engineering approaches and call for innovation across multiple technical domains and levels of hierarchical abstraction.
Being able to sense, measure, interpret, connect, and analyze data coming from the real world is critical to meeting the needs of these emerging applications. Semiconductor technology is the foundation upon which these solutions are being built in support of more complete system-level solutions. Innovating in both the hardware and software domains is critical to building a future that is safer, smarter, autonomous, connected, efficient and affordable. This talk will address these trends and discuss how semiconductor companies need to adapt to thrive in this evolving environment.

Biography

David H. Robertson has been with the Data Converter group of Analog Devices since graduating from Dartmouth College in 1985. He has worked on a wide variety of high speed D/A and A/D converters on complementary bipolar, BiCMOS and CMOS processes. He has held positions as a Product Engineer, Design Engineer, and Product Line Director and VP of Analog Technology, working with product development teams in the US, Ireland, Korea, Japan, and China. Dave is presently the Product and Technology Director for ADI’s High Speed Converter group, and is an ADI Technical Fellow.
Dave holds 15 patents on converter and mixed signal circuits, has more than a dozen published peer reviewed papers. He has participated in numerous “best panel” International Solid State Circuits Conference evening panel sessions, and was co-author of the paper that received the IEEE Journal of Solid State Circuits 1997 Best Paper Award. Dave is a senior member of the IEEE, and served on the ISSCC technical program committee from 2000 through 2008, chairing the Analog and Data Converter subcommittees from 2002 to 2008.

Reid R. Harrison

May 28

Building better tools for neuroscience: Custom microchips for electrophysiology instrumentation

Monitoring the electrical potentials produced by the nervous system can provide a wealth of information for both scientific and clinical endeavors. Advances in high-density microelectrode technology have spurred the development of neural recording systems capable of monitoring 100 or more electrophysiological signals. In contrast to the tiny electrodes, the supporting instrumentation is typically large, heavy, and expensive. Modern microelectronics technology provides a means for dramatically reducing the size, weight, and cost of the electronics required to acquire biopotential signals from MEMS electrode arrays.
Designing integrated circuits for neuroscience research presents significant technological challenges. Power must be minimized to prevent local tissue heating that could kill cells. Amplifiers must be able to resolve weak ac extracellular signals in the microvolt range while rejecting large dc offsets present at the electrode-tissue interface. In this talk I will present custom integrated circuits developed for a wide variety of state-of-the-art neural interfacing applications: recording many signals from high-density microelectrodes, activating neural tissue through electrical stimulation, and intracellular patch clamp recording. The path from academic research to commercialization in a small company will also be illustrated.

Biography

Reid Harrison received a B.S. in electrical engineering from the University of Florida in 1994 and a Ph.D. in computation & neural systems from Caltech in 2000. After completing his doctorate, he joined the electrical engineering faculty at the University of Utah and developed the first low-noise neural amplifier with sufficiently low power consumption to permit integration with implantable electrode arrays. He first published this circuit at the 2002 ISCAS conference in Scottsdale, Arizona. His following 2003 IEEE Journal of Solid-State Circuits paper describing this innovation has been cited more than 1,300 times.

In 2010 he left academia and founded Intan Technologies in Los Angeles to commercialize microelectronics for large-scale neural recording. Intan Technologies now supplies advanced electrophysiology interface chips to companies and research groups in more than 45 countries worldwide.

Dr. Harrison’s interests include low-power analog and mixed-signal CMOS circuit design, integrated electronics for neural interfaces and other biomedical devices, and hardware for biologically inspired computational systems. He has served on the technical program committees of the International Solid-State Circuits Conference (ISSCC) and the International Symposium on Circuits and Systems (ISCAS).

Title: Building better tools for neuroscience: Custom microchips for electrophysiology instrumentation

Speaker: Reid R. Harrison

Company: Intan Technologies

Title: The Digital Transformation: Connecting The Sand to The Cloud

Speaker: Alessandro Cremonesi

Company: STMicroelectronics

Alessandro Cremonesi

May 29

The Digital Transformation: Connecting The Sand to The Cloud

In his speech Alessandro Cremonesi will give his perspective of major trends in electronics for the next years. New services and applications will be fueled by the evolution of the electronic systems and by the evolution of the cloud technologies. Both together will bring us to a new way to handle our life, our work, our social interactions and our interaction with the environment. AI is already at the point to create a discontinuity penetrating IoT nodes offering new capabilities and opening new frontiers. New Industry sectors will be part of the new electronic game rising up the importance of ecosystems and communities in the digital transformation that is pervading our social and professional life. This will bring lot of challenges in front of us not only from technical but also from business approach point of view.
In his speech, Alessandro Cremonesi will offer his views on the major trends that will shape the electronics field in the forthcoming years. New services and applications will be fueled by evolution both in electronics systems and in cloud technologies. Together, the two will bring up new ways in which we handle our lives, jobs, social interactions and interactions with the environment. Artificial Intelligence has already reached a discontinuity point where it can move from large computing systems into pervasive IoT nodes, so offering new opportunities and opening new frontiers. Whole new industrial sectors will develop in this rapidly changing electronic systems playground, underlining the importance of communities and ecosystems in the digital transformation that pervades our social and professional lives. All this is going to bring new challenges ahead, not just from the technical point of view, but also in a business approach perspective.

Biography

Alessandro Cremonesi is Group Vice President, General Manager of ST Central Labs, and has held this position since July 2013. In this role, he manages the Company’s Labs dedicated to System Application and Innovation worldwide with responsibilities that span from corporate advanced R&D to system-solutions support for ST customers.

After a period of research activity in opto-electronics at the University of Pavia, Italy, Cremonesi joined STMicroelectronics in 1984. He has served in different managerial roles, responsible for both Strategic Marketing and R&D activities across multiple domains from telecommunications and cellular to audio/video digital-signal processing and multimedia applications. Most recently, Cremonesi has also been active in supporting the Company’s extensive efforts in IoT.

Cremonesi performs institutional and advisory roles with several industrial and academic bodies. He has authored several technical papers and patents in analog and digital signal processing and is a member of the Scientific Advisory Board at IMEC.

Denny Monti

May 30

Digital Manufacturing: from the FCA journey to a general framework

Industry 4.0 is a fast growing reality and digital technology is a strong portion of that. Roughly speaking, we may say that the latter connects the dots across the entire value stream. Networked sensors and software allow to collect, share and analyze data in great amounts at high speed and low cost. This improves efficiency, productivity and performance in industrial organization. We will show some examples of applications of this approach for the FCA Melfi plant which received the Agamus 2016 “Automotive Lean Produktion award” as the European smartest factory. Despite these successes, the journey is still far from being complete, since a great effort is now needed to connect shop floor devices and gather data for analytics – as anyone typically rely today on proprietary (vs. open) communication protocols. We will show how the next smart factory generation will require:

  • a significant increase in the amount of data collected;
  • a simplification and enhancement in connectivity;
  • to facilitate data gathering from many different sources

Biography

Denny Monti is currently the Vice President of FCA Global Manufacturing Engineering Vehicle and EMEA Manufacturing Engineering Director, a position to which he was appointed in November 2015. Among his missions there are, for example, the implementation and evolution of Industry 4.0 in FCA and the global and regional reorganization of manufacturing engineering by means of process digitalization and production standards optimization, with the final goal to reduce production costs and lead to faster innovation.

From 2013 to 2015 he was FCA Manufacturing Engineering Director in charge of implementing the most modern, flexible and largest FCA plant in North-East Brazil, i.e. the Pernambuco Plant, which he supervised starting from the initial concept through the different building phases of civil and technologic works until the inauguration of the plant and the production development.

From 2009 to 2013 he was the FCA he was the manager of the Manufacturing Engineering General Assembly. His main mission was to completely revolutionize the assembly processes, to increase flexibility, modularity, logistic integration and, where necessary, automation. This allowed to greatly enhance the final quality of cars, the overall ergonomics for the plant workers, and the creation of standardized global processes as well as great enhancement in investments’ scalability.
From 1995 to 2013 he was Comau SpA. After different experiences in different sectors such as Material Handling, Robotics, Powertrain and Body Welding, he was appointed Director of the Mechanical Design of Comau Welding Systems, a role in which, in 2004 founded the Advanced Engineering area dedicated to the R&D area, Product Development and Standardization. In this area have been created the most innovative and flexible automatic production systems for cars’ steel bodywork, which were used for the first time by Fiat S.p.A for the car frame production of the Alfa Romeo Giulietta in 2008. Since then, the flexible steel bodywork (known as Butterfly) became the Global standard in Fiat and afterwards, in FCA Group and similar systems are still used nowadays by major global OEMs.

Denny Monti holds more than 10 international patents on innovative solutions of industrial production systems in Comau and FCA.

Title: Digital Manufacturing: from the FCA journey to a general framework

Speaker: Denny Monti

Company: Fiat Chrysler Automobiles

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